Materials for Advanced Packaging Hardback
Edited by Daniel Lu, C. P. Wong
Significant progress has been made in advanced packaging in recent years.
Several new packaging techniques have been developed and new packaging materials have been introduced.
This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications.
The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
- Format: Hardback
- Pages: 724 pages, 15 Tables, black and white; 300 Illustrations, black and white; XII, 724 p. 300 illus.
- Publisher: Springer-Verlag New York Inc.
- Publication Date: 01/12/2008
- Category: Industrial chemistry & manufacturing technologies
- ISBN: 9780387782188