Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications
Shichun Qu
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New Polymeric Products : Fundamentals, Forming Methods and Applications
Yong Liu
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Melt Electrospinning : A Green Method to Produce Superfine Fibers
Yong Liu
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Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing
Shen (Huazhong University of Science and Technology, Wuhan, Hubei Liu
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Shen Liu
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Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing
Shen Liu
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Quality of Service in Optical Burst Switched Networks
Kee Chaing Chua
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Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
Yong Liu
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Value in Business : A Holistic, Systems-based Approach to Creating and Achieving Value
Jeffrey Yi-Lin Forrest
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Value in Business : A Holistic, Systems-based Approach to Creating and Achieving Value
Jeffrey Yi-Lin Forrest
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Value in Business : A Holistic, Systems-based Approach to Creating and Achieving Value
Jeffrey Yi-Lin Forrest
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