Reliability of RoHS-Compliant 2D and 3D IC Interconnects
John Lau
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Through-Silicon Vias for 3D Integration
John Lau
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3D IC Integration and Packaging
John Lau
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Basics Fashion Design 09: Designing Accessories : Exploring the design and construction of bags, shoes, hats and jewellery
John Lau
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Basics Fashion Design 09: Designing Accessories : Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
John Lau
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