Designing TSVs for 3D Integrated Circuits PDF
by Nauman Khan, Soha Hassoun
Part of the SpringerBriefs in Electrical and Computer Engineering series
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Description
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts.
The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs.
The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network.
Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available.
Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
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- Format:PDF
- Publisher:Springer New York
- Publication Date:22/09/2012
- Category:
- ISBN:9781461455080
Information
-
Download Now
- Format:PDF
- Publisher:Springer New York
- Publication Date:22/09/2012
- Category:
- ISBN:9781461455080