Advances in Thermal Modelling of Electronic Components and Systems v. 2, Paperback / softback Book

Advances in Thermal Modelling of Electronic Components and Systems v. 2 Paperback / softback

Paperback / softback

Available to Order - This title is available to order, with delivery expected within 2 weeks
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The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules.

This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks.

In addition, it offers a critical review of recent technical and patent literature in electronics cooling.

This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

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Available to Order - This title is available to order, with delivery expected within 2 weeks
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