Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging PDF
by Jong-Hoon Lee, Manos M. Tentzeris
Part of the Synthesis Lectures on Computational Electromagnetics series
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Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
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- Format:PDF
- Publisher:Springer International Publishing
- Publication Date:31/05/2022
- Category:
- ISBN:9783031017032
Information
-
Download Now
- Format:PDF
- Publisher:Springer International Publishing
- Publication Date:31/05/2022
- Category:
- ISBN:9783031017032
