RF and Microwave Microelectronics Packaging PDF
Edited by Ken Kuang, Franklin Kim, Sean S. Cahill
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Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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- Format:PDF
- Publisher:Springer US
- Publication Date:01/12/2009
- Category:
- ISBN:9781441909848
Information
-
Download Now
- Format:PDF
- Publisher:Springer US
- Publication Date:01/12/2009
- Category:
- ISBN:9781441909848