Advanced Electronic Packaging, Hardback Book

Advanced Electronic Packaging Hardback

Edited by Richard K. (University of Arkansas) Ulrich, William D. (University of Arkansas) Brown

Part of the IEEE Press Series on Microelectronic Systems series

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As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.

There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters.

All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

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