Packaging of High Power Semiconductor Lasers PDF
by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
Part of the Micro- and Opto-Electronic Materials, Structures, and Systems series
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Description
This book introduces high power semiconductor laser packaging design.
The challenges of the design and various packaging and testing techniques are detailed by the authors.
New technologies and current applications are described in detail.
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- Format:PDF
- Publisher:Springer New York
- Publication Date:14/07/2014
- Category:
- ISBN:9781461492634
Information
-
Download Now
- Format:PDF
- Publisher:Springer New York
- Publication Date:14/07/2014
- Category:
- ISBN:9781461492634