Thin Films: Volume 308 : Stresses and Mechanical Properties IV
Peter (Cornell University, New York) Borgesen
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Materials Reliability in Microelectronics IV: Volume 338
Peter (Cornell University, New York) Borgesen
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Thin Films: Volume 356 : Stresses and Mechanical Properties V
Shefford P. (Max-Planck-Institut fur Metallforschung, Germany) Baker
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Electronic Packaging Materials Science VIII: Volume 390
Peter Borgesen
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