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TSV 3D RF Integration : High Resistivity Si Interposer Technology - eBook

TSV 3D RF Integration : High Resistivity Si Interposer Technology

Shenglin Ma

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Format: eBook (EPUB)

£195.00

£185.25

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Introduction to Microsystem Packaging Technology - eBook

Introduction to Microsystem Packaging Technology

Yufeng Jin

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Format: eBook (PDF)

£56.99

£51.29

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Introduction to Microsystem Packaging Technology - eBook

Introduction to Microsystem Packaging Technology

Yufeng Jin

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Format: eBook (EPUB)

£56.99

£51.29

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