Enabling Technologies for 3-D Integration: Volume 970 Hardback
Edited by Christopher A. Bower, Philip E. Garrou, Peter Ramm, Kenji Takahashi
Part of the MRS Proceedings series
Hardback
- Information
Description
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips.
The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry.
Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers.
The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor.
Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
Information
-
Unavailable
- Format:Hardback
- Pages:295 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:30/03/2007
- Category:
- ISBN:9781558999275
Information
-
Unavailable
- Format:Hardback
- Pages:295 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:30/03/2007
- Category:
- ISBN:9781558999275