Interfaces between Polymers, Metals, and Ceramics: Volume 153
Benjamin M. DeKoven
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Materials Issues in Microcrystalline Semiconductors: Volume 164
Philippe M. (Princeton University, New Jersey) Fauchet
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Neutron Scattering for Materials Science: Volume 166
J. D. (Argonne National Laboratory, Illinois) Jorgensen
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Advanced Electronic Packaging Materials: Volume 167
Andrew T. Barfknecht
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High Temperature Superconductors: Volume 169 : Fundamental Properties and Novel Materials Processing
David Christen
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Laser Ablation for Materials Synthesis: Volume 191
David C. (Brown University, Rhode Island) Paine
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Electronic Packaging Materials Science V: Volume 203
Edwin D. Lillie
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Chemical Perspectives of Microelectronic Materials II: Volume 204
L. H. (AT&T Bell Laboratories, New Jersey) Dubois
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High-Temperature Ordered Intermetallic Alloys IV: Volume 213
L. A. Johnson
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Phase Formation and Modification by Beam-Solid Interactions: Volume 235
David M. Follstaedt
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Thin Films: Volume 239 : Stresses and Mechanical Properties III
E. Arzt
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Low Temperature (LT) GaAs and Related Materials: Volume 241
Robert (Massachusetts Institute of Technology) Calawa
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Synthesis and Processing of Ceramics:: Volume 249 : Scientific Issues
Wendell E. (Massachusetts Institute of Technology) Rhine
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Application of Multiple Scattering Theory to Materials Science: Volume 253
W. H. Butler
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Specimen Preparation for Transmission Electron Microscopy of Materials III: Volume 254
Ron Anderson
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Electronic Packaging Materials Science VI: Volume 264
Paul S. (University of Texas, Austin) Ho
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Computational Methods in Materials Science: Volume 278
Martin E. (Rensselaer Polytechnic Institute, New York) Glicksman
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