Thin Films:: Volume 130 : Stresses and Mechanical Properties I
John C. (Stanford University, California) Bravman
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High-Temperature Ordered Intermetallic Alloys III: Volume 133
C. C. (North Carolina State University) Koch
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High Resolution Microscopy of Materials: Volume 139
William (IBM T J Watson Research Center, New York) Krakow
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Nondestructive Monitoring of Materials Properties: Volume 142
John Holbrook
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Synchrotron Radiation in Materials Research: Volume 143
Roy (University of Michigan, Ann Arbor) Clarke
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III-V Heterostructures for Electronic/Photonic Devices: Volume 145
A. C. Gossard
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Amorphous Silicon Technology 1989: Volume 149
Y. (University of Osaka, Japan) Hamakawa
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Interfaces between Polymers, Metals, and Ceramics: Volume 153
Benjamin M. DeKoven
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Materials Issues in Microcrystalline Semiconductors: Volume 164
Philippe M. (Princeton University, New Jersey) Fauchet
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Neutron Scattering for Materials Science: Volume 166
J. D. (Argonne National Laboratory, Illinois) Jorgensen
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Advanced Electronic Packaging Materials: Volume 167
Andrew T. Barfknecht
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High Temperature Superconductors: Volume 169 : Fundamental Properties and Novel Materials Processing
David Christen
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Laser Ablation for Materials Synthesis: Volume 191
David C. (Brown University, Rhode Island) Paine
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Electronic Packaging Materials Science V: Volume 203
Edwin D. Lillie
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Chemical Perspectives of Microelectronic Materials II: Volume 204
L. H. (AT&T Bell Laboratories, New Jersey) Dubois
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High-Temperature Ordered Intermetallic Alloys IV: Volume 213
L. A. Johnson
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Materials Reliability Issues in Microelectronics: Volume 225
James R. Lloyd
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Synthesis/Characterization and Novel Applications of Molecular Sieve Materials: Volume 233
R. L. Bedard
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Phase Formation and Modification by Beam-Solid Interactions: Volume 235
David M. Follstaedt
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